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EVG 510 Wafer Bonder

eagle-i ID

http://eagle-i.itmat.upenn.edu/i/00000152-3178-1d50-aeee-612f80000000

Resource Type

  1. Flip chip bonder

Properties

  1. Resource Description
    The EVG501 Wafer Bonding System is a highly flexible R&D system that can handle small substrate pieces up to 200 mm wafers. The new tool supports a variety of bonding processes, such as anodic, glass frit, eutectic, diffusion, fusion, solder,and adhesive bonds, as well as other thermal processes, including oxide removal and high temperature bakes under a controlled atmosphere. The system also offers quick re-tooling with a conversion time of less than five minutes, making it ideal for universities and R&D as well as small-volume production applications. Features R&D and pilot line production Bonds up to 10 kN force at temperatures up to 450°C Real and low-force wafer wedge compensation system for highest yield Large process window: temperature uniformity <+/- 1% and pressure uniformity <+/- 5% <img src="http://www.nano.upenn.edu/wp-content/uploads/2014/09/EVG-510-Wafer-Bonder-225x300.jpg" alt="EVG 510 Wafer Bonder">
  2. Manufacturer
    EV Group
  3. Model Number
    EVG 510
  4. Website(s)
    http://www.nano.upenn.edu/resources/equipmentinstrumentation/
  5. Part of Collection
    Quattrone Nanofabrication Facility
  6. Location
    Singh Center for Nanotechnology (Penn)
 
RDFRDF
 
Provenance Metadata About This Resource Record
  1. workflow state
    Published
  2. contributor
    fcoldren
  3. created
    2016-01-11T11:17:01.871-05:00
  4. creator
    fcoldren
  5. modified
    2016-01-12T09:10:22.429-05:00

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The eagle-i Consortium is supported by NIH Grant #5U24RR029825-02 / Copyright 2016