EVG 620 Wafer Bond Aligner

eagle-i ID

Resource Type

Properties

1. Resource Description

   Known for its high level of automation and reliability, the EVG620 Bond Alignment System is designed for wafer-to-wafer alignment up to 150 mm wafer sizes. The EV Group´s bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG´s bond alignment system accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications. Features Supports bond alignment of double or triple wafer stacks up to 150 mm wafer sizes Manual or motorized alignment stage Fully motorized high resolution bottom side microscopes Windows® based user interface Quick tool change between different wafer sizes and different bonding applications <img src="http://www.nano.upenn.edu/wp-content/uploads/2014/09/EVG-620-Wafer-Bond-Aligner-225x300.jpg" alt="EVG 620 Wafer Bond Aligner">

2. Manufacturer

   EV Group

3. Model Number

   EVG 620

4. Website(s)

   http://www.nano.upenn.edu/resources/equipmentinstrumentation/

5. Part of Collection

   Quattrone Nanofabrication Facility

6. Location

   Singh Center for Nanotechnology (Penn)