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EVG 620 Wafer Bond Aligner
eagle-i ID
http://eagle-i.itmat.upenn.edu/i/00000152-31d6-656e-aeee-612f80000000
Resource Type
Properties
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Resource Description
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Known for its high level of automation and reliability, the EVG620 Bond Alignment System is designed for wafer-to-wafer alignment up to 150 mm wafer sizes. The EV Group´s bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG´s bond alignment system accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
Features
Supports bond alignment of double or triple wafer stacks up to 150 mm wafer sizes
Manual or motorized alignment stage
Fully motorized high resolution bottom side microscopes
Windows® based user interface
Quick tool change between different wafer sizes and different bonding applications
<img src="http://www.nano.upenn.edu/wp-content/uploads/2014/09/EVG-620-Wafer-Bond-Aligner-225x300.jpg" alt="EVG 620 Wafer Bond Aligner">
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Manufacturer
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EV Group
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Model Number
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EVG 620
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Website(s)
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http://www.nano.upenn.edu/resources/equipmentinstrumentation/
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Part of Collection
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Quattrone Nanofabrication Facility
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Location
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Singh Center for Nanotechnology (Penn)
