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Oxford Plasma Lab 100

eagle-i ID

http://eagle-i.itmat.upenn.edu/i/00000152-3204-5e8d-aeee-612f80000000

Resource Type

  1. Chemical vapor deposition system

Properties

  1. Resource Description
    This is a load locked PECVD system capable of depositing SiO2, Si3N4 and a-Si. Process temperatures range from room temperature through 400C. In addition to standard RF plasma, there is a low frequency source for stress tuning films. The system handles 4”/100mm wafers. <img src="http://www.nano.upenn.edu/wp-content/uploads/2014/09/Oxford-Plasma-Lab-100-300x225.jpg" alt="Oxford Plasma Lab 100">
  2. Manufacturer
    Oxford Instruments
  3. Model Number
    Plasmalab System 100
  4. Website(s)
    http://www.nano.upenn.edu/resources/equipmentinstrumentation/
  5. Part of Collection
    Quattrone Nanofabrication Facility
  6. Location
    Singh Center for Nanotechnology (Penn)
 
RDFRDF
 
Provenance Metadata About This Resource Record
  1. workflow state
    Published
  2. contributor
    fcoldren
  3. created
    2016-01-11T13:50:30.594-05:00
  4. creator
    fcoldren
  5. modified
    2016-01-12T09:10:45.684-05:00

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