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Oxford PlasmaLab 80+

eagle-i ID

http://eagle-i.itmat.upenn.edu/i/00000152-3210-f20e-aeee-612f80000000

Resource Type

  1. Reactive ion etcher

Properties

  1. Resource Description
    A compact open-loading tool for Reactive Ion Etching – Oxford 80+ RIE The Oxford 80+ offers versatile reactive ion etch solutions on one platform with convenient open loading. This compact, small footprint system is easy to use, with no compromise on process quality. It is ideally suited to R&D or small-scale production, and can process from the smallest wafer pieces to 200mm wafers. The open load design allows fast wafer loading and unloading, ideal for research, prototyping and low-volume production. 600W RF generator Up to 200mm wafers Process gases: CF4, Ar, O2, SF6 and CHF3 Excellent etch control Excellent process control Documented baseline recipes are provided by Penn’s QNF staff <img src="http://www.nano.upenn.edu/wp-content/uploads/2014/09/DE-04-225x300.jpg" alt="Oxford PlasmaLab 80+">
  2. Manufacturer
    Oxford Instruments
  3. Model Number
    Plasmalab 80 Plus
  4. Website(s)
    http://www.nano.upenn.edu/resources/equipmentinstrumentation/
  5. Part of Collection
    Quattrone Nanofabrication Facility
  6. Location
    Singh Center for Nanotechnology (Penn)
 
RDFRDF
 
Provenance Metadata About This Resource Record
  1. workflow state
    Published
  2. contributor
    fcoldren
  3. created
    2016-01-11T14:03:14.626-05:00
  4. creator
    fcoldren
  5. modified
    2016-01-12T09:12:20.609-05:00

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The eagle-i Consortium is supported by NIH Grant #5U24RR029825-02 / Copyright 2016