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SPTS Xactix Xetch

eagle-i ID


Resource Type

  1. Reactive ion etcher


  1. Resource Description
    Isotropic etching of silicon using xenon difluoride is an ideal solution for releasing MEMS devices. XeF2 shows high selectivity to silicon over almost all standard semiconductor materials including photoresist, silicon dioxide, silicon nitride and aluminum. Being a vapor phase etchant, XeF2 avoids many of the problems typically associated with wet or plasma etch processes. Built for simplicity, and a small footprint, the Xactix® e1TM is the ideal solution for requiring an R&D xenon difluoride etching system. This table top etcher is ideal for small volumes in QNF. Key Benefits Simple & reliable Great for working with small samples and wafers <img src="http://www.nano.upenn.edu/wp-content/uploads/2014/09/DE-06-225x300.jpg" alt="SPTS Xactix Xetch">
  2. Additional Name
    Xactix® XeF2 Release Etch System
  3. Manufacturer
    SPP Process Technology Systems
  4. Model Number
    Xactix® XeF2
  5. Website(s)
  6. Part of Collection
    Quattrone Nanofabrication Facility
  7. Location
    Singh Center for Nanotechnology (Penn)
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The eagle-i Consortium is supported by NIH Grant #5U24RR029825-02 / Copyright 2016