Technics RIE

eagle-i ID

Resource Type

Properties

1. Resource Description

   The Technics Series 800 RIE (Oxygen Plasma Asher) uses an oxygen plasma to remove organic materials, such as photoresist, from substrate surfaces. Common uses include descumming of resist from exposed surfaces before etching or metallization, or the cleaning of substrates to remove stubborn resist deposits. An oxygen plasma is used to isotropically remove organic material, like photoresist. Placing a substrate or wafer in an oxygen plasma for short periods of time will remove any unwanted thin layers of photoresist and clean up pattern edges. In essence, the plasma ashing or burning of the photoresist removes it. This material residue is normally referred to as scum. <img src="http://www.nano.upenn.edu/wp-content/uploads/2014/09/DE-03-225x300.jpg" alt="Technics RIE">

2. Manufacturer

   Technics

3. Model Number

   800 REI

4. Website(s)

   http://www.nano.upenn.edu/resources/equipmentinstrumentation/

5. Part of Collection

   Quattrone Nanofabrication Facility

6. Location

   Singh Center for Nanotechnology (Penn)