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Technics RIE
eagle-i ID
http://eagle-i.itmat.upenn.edu/i/00000152-321e-059f-aeee-612f80000000
Resource Type
Properties
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Resource Description
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The Technics Series 800 RIE (Oxygen Plasma Asher) uses an oxygen plasma to remove organic materials, such as photoresist, from substrate surfaces. Common uses include descumming of resist from exposed surfaces before etching or metallization, or the cleaning of substrates to remove stubborn resist deposits. An oxygen plasma is used to isotropically remove organic material, like photoresist. Placing a substrate or wafer in an oxygen plasma for short periods of time will remove any unwanted thin layers of photoresist and clean up pattern edges. In essence, the plasma ashing or burning of the photoresist removes it. This material residue is normally referred to as scum.
<img src="http://www.nano.upenn.edu/wp-content/uploads/2014/09/DE-03-225x300.jpg" alt="Technics RIE">
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Manufacturer
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Technics
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Model Number
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800 REI
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Website(s)
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http://www.nano.upenn.edu/resources/equipmentinstrumentation/
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Part of Collection
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Quattrone Nanofabrication Facility
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Location
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Singh Center for Nanotechnology (Penn)
