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Technics RIE

eagle-i ID

http://eagle-i.itmat.upenn.edu/i/00000152-321e-059f-aeee-612f80000000

Resource Type

  1. Reactive ion etcher

Properties

  1. Resource Description
    The Technics Series 800 RIE (Oxygen Plasma Asher) uses an oxygen plasma to remove organic materials, such as photoresist, from substrate surfaces. Common uses include descumming of resist from exposed surfaces before etching or metallization, or the cleaning of substrates to remove stubborn resist deposits. An oxygen plasma is used to isotropically remove organic material, like photoresist. Placing a substrate or wafer in an oxygen plasma for short periods of time will remove any unwanted thin layers of photoresist and clean up pattern edges. In essence, the plasma ashing or burning of the photoresist removes it. This material residue is normally referred to as scum. <img src="http://www.nano.upenn.edu/wp-content/uploads/2014/09/DE-03-225x300.jpg" alt="Technics RIE">
  2. Manufacturer
    Technics
  3. Model Number
    800 REI
  4. Website(s)
    http://www.nano.upenn.edu/resources/equipmentinstrumentation/
  5. Part of Collection
    Quattrone Nanofabrication Facility
  6. Location
    Singh Center for Nanotechnology (Penn)
 
RDFRDF
 
Provenance Metadata About This Resource Record
  1. workflow state
    Published
  2. contributor
    fcoldren
  3. created
    2016-01-11T14:18:00.605-05:00
  4. creator
    fcoldren
  5. modified
    2016-01-12T09:12:34.143-05:00

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