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ABM 3000

eagle-i ID


Resource Type

  1. Mask aligner


  1. Resource Description
    The 3000HR series Mask Aligner is high resolution, Contact/Proximity Aligner. The system offers precise and repeatable sub-micron alignment and exposure for many wafer and substrate sizes. This includes sensitive, brittle and odd shaped materials. The precision wedge-error compensation vacuum chucks offer consistent mask to substrate planarization for accurate separation adjustment and ease of alignment. Specifications: 350 Watt UV Exposure System with Intensity Controlling Power Supply 365 nm Output Intensity – Approximately 20-25 mW/cm² 400 nm Output Intensity – Approximately 40-50 mW/cm² Uniform/Collimated Beam Size: 5.0″ Diameter Beam Uniformity: ± 3-5% Adjustable Expose Timer: Adjustable from .1 to 999.9 Seconds Nikon Single Field Binocular Microscope with 5x, 10x, & 20x Objectives, 10x Eyepieces, including Adjustable Coaxial Illuminator. Stationary Mask Alignment Module with X,Y,Z, and Theta Motion Electronic/Pneumatic Operator Control Panel Top Load Vacuum Holders for 4” x 4 and ”5” x 5” Masks Planarizing Vacuum Chuck for Piece Parts (up to 1” Diameter) & 4” Wafers Z axis Adjustment: ±750 µm Mask-to-Substrate Separation: settable in 10 µm increments Front-side Alignment Accuracy: < 0.5 µ Printing Resolution: Near UV < 0.8µm <img src="http://www.nano.upenn.edu/wp-content/uploads/2014/09/MA-03v2-300x225.jpg" alt="ABM 3000">
  2. Additional Name
    AMB 3000HR Mask Aligner
  3. Manufacturer
    ABM, Inc.
  4. Model Number
  5. Website(s)
  6. Part of Collection
    Quattrone Nanofabrication Facility
  7. Location
    Singh Center for Nanotechnology (Penn)
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Copyright © 2016 by the President and Fellows of Harvard College
The eagle-i Consortium is supported by NIH Grant #5U24RR029825-02 / Copyright 2016