ABM 3000

eagle-i ID

Resource Type

Properties

1. Resource Description

   The 3000HR series Mask Aligner is high resolution, Contact/Proximity Aligner. The system offers precise and repeatable sub-micron alignment and exposure for many wafer and substrate sizes. This includes sensitive, brittle and odd shaped materials. The precision wedge-error compensation vacuum chucks offer consistent mask to substrate planarization for accurate separation adjustment and ease of alignment. Specifications: 350 Watt UV Exposure System with Intensity Controlling Power Supply 365 nm Output Intensity – Approximately 20-25 mW/cm² 400 nm Output Intensity – Approximately 40-50 mW/cm² Uniform/Collimated Beam Size: 5.0″ Diameter Beam Uniformity: ± 3-5% Adjustable Expose Timer: Adjustable from .1 to 999.9 Seconds Nikon Single Field Binocular Microscope with 5x, 10x, & 20x Objectives, 10x Eyepieces, including Adjustable Coaxial Illuminator. Stationary Mask Alignment Module with X,Y,Z, and Theta Motion Electronic/Pneumatic Operator Control Panel Top Load Vacuum Holders for 4” x 4 and ”5” x 5” Masks Planarizing Vacuum Chuck for Piece Parts (up to 1” Diameter) & 4” Wafers Z axis Adjustment: ±750 µm Mask-to-Substrate Separation: settable in 10 µm increments Front-side Alignment Accuracy: < 0.5 µ Printing Resolution: Near UV < 0.8µm <img src="http://www.nano.upenn.edu/wp-content/uploads/2014/09/MA-03v2-300x225.jpg" alt="ABM 3000">

2. Additional Name

   AMB 3000HR Mask Aligner

3. Manufacturer

   ABM, Inc.

4. Model Number

   3000HR

5. Website(s)

   http://www.nano.upenn.edu/resources/equipmentinstrumentation/

6. Part of Collection

   Quattrone Nanofabrication Facility

7. Location

   Singh Center for Nanotechnology (Penn)