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Suss MicroTec AltaSpray Automated Spray Coated AS8

eagle-i ID


Resource Type

  1. Instrument


  1. Resource Description
    Suss MicroTec AltaSpray Automated Spray Coated AS8 Automated Spray Coater for High Topographies SUSS MicroTec’s proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging. Wafer sizes from pieces to 200mm. Common resists sprayed are SU-8, S1800 and various AZ formulations. <img src="http://www.nano.upenn.edu/wp-content/uploads/2014/09/RC-01v2-225x300.jpg" alt="Suss MicroTec AltaSpray Automated Spray Coated AS8">
  2. Additional Name
  3. Manufacturer
    S√úSS MicroTec AG
  4. Model Number
  5. Website(s)
  6. Part of Collection
    Quattrone Nanofabrication Facility
  7. Location
    Singh Center for Nanotechnology (Penn)
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