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Singh Center for Nanotechnology (Penn)

Director: Allen, Mark G., Ph.D.

Summary:

The Singh Center is centered around four major research facilities, all featuring state-of-the-art equipment for nanoscale characterization, measurement, and fabrication: the Quattrone Nanofabrication Facility, the Nanoscale Characterization Facility, the Scanning and Local Probe Facility, and the Material Property Measurement Facility.

The following connected sections comprise the major components of the building:

• A 10,000 square-foot next-generation Cleanroom Facility for micro/nanofabrication, including tooling for nanoscale and soft materials integration and a novel nano/bio bay serves as the home of the Quattrone Nanofabrication Facility.

• A 10,000 square-foot advanced underground facility designed for temperature stability and excellent isolation from vibrational, acoustic, and electromagnetic noise serves as home of both the Nanoscale Characterization Facility and the Scanning and Local Probe Facility.

• A Property Measurement Facility provides state-of-the-art measurement capabilities in magnetometry, optics, electrical and thermal transport.

• 18,000 net square feet of space for other shared facilities and general laboratories housed in an adjoining three story structure; a glass-enclosed galleria with views into the cleanroom; conference rooms; and a forum for meetings.

The building houses a large suite of high-performance equipment for nanotechnology research, including electron and scanning probe microscopy, cleanroom tools, electron beam lithography, and several materials synthesis and characterization instruments.

The multi-user facilities are vital to the research and educational programs at Penn and are leveraged by partner institutions and local industry within the Mid-Atlantic region. Unifying these central resources fosters the exchange of scientific ideas and the development of nanoscale science and technology, brings together crosscutting capabilities and the staffing to support these tools, and provides the modern infrastructure necessary to establish a regional center for nanotechnology.

Affiliations:

People:

Resources:

Instruments

  • ABM 3000 ( Mask aligner )

    The 3000HR series Mask Aligner is high resolution, Contact/Proximity Aligner. The system offers precise and repeatable sub-micron alignment and exposure for many wafer and substrate sizes. This includes sensitive, brittle and odd shaped materials. The precision wedge-error compensation vacuum chucks offer consistent mask to substrate planarization for accurate separation adjustment and ease of alignment.

    Specifications:
    350 Watt UV Exposure System with Intensity Controlling Power Supply
    365 nm Output Intensity – Approximately 20-25 mW/cm²
    400 nm Output Intensity – Approximately 40-50 mW/cm²
    Uniform/Collimated Beam Size: 5.0″ Diameter
    Beam Uniformity: ± 3-5%
    Adjustable Expose Timer: Adjustable from .1 to 999.9 Seconds
    Nikon Single Field Binocular Microscope with 5x, 10x, & 20x Objectives, 10x Eyepieces, including Adjustable Coaxial Illuminator.
    Stationary Mask Alignment Module with X,Y,Z, and Theta Motion
    Electronic/Pneumatic Operator Control Panel
    Top Load Vacuum Holders for 4” x 4 and ”5” x 5” Masks
    Planarizing Vacuum Chuck for Piece Parts (up to 1” Diameter) & 4” Wafers
    Z axis Adjustment: ±750 µm
    Mask-to-Substrate Separation: settable in 10 µm increments
    Front-side Alignment Accuracy: < 0.5 µ
    Printing Resolution: Near UV < 0.8µm

    ABM 3000

  • Acid Process Bench ( Wet chemical bench )

    Substrates up to 150mm
    Heated ultrasonic tank
    Goose neck sink
    N2 and DI water guns

    Acid Process Bench

  • Acid Process Bench ( Wet chemical bench )

    Two process stations
    Substrates up to 150mm
    Cascade rinse tank
    Goose neck sink
    N2 and DI water guns

    Acid Process Bench

  • ADT 7100 Dicing Saw ( Saw )

    Workhorse dicing saw with precision dicing and alignment system.  This is an automated tool with a 2″, DC-brushless, 1.2 kW, Front-mounted, Air-bearing Spindle (60 krpm Max.), with closed-loop turntable, and is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm.

    ADT 7100 Dicing Saw

  • Agilent E3620 ( Power supply )

    Agilent E3620
    Output 1: 0 to 25 V, 0 to 1 A
    Output 2: 0 to 25 V, 0 to 1 A
    Power (max): 50 W
    Ripple & Noise from 20 Hz to 20 MHz
    Normal Mode Voltage rms: 350 µV
    Peak-to-Peak: 1.5 mV
    Load & Line Regulation
    01% + 2mV
    Meter Resolution
    Voltage: 10 mV (0-20 V), 100 mV, (>20 V)
    Current: 1 mA

    Agilent E3620

  • Anatech SCE 106 ( Plasma etcher )

    Anatech USA’s SCE-100 Series Inductively Coupled (ICP) Plasma systems are extremely effective for a Plasma Ashing process to activate a surface prior to bonding PDMS, e.g.

    Process gases is O2. Sample sizes are pieces to 100mm round wafers.

    Anatech SCE 106

  • Anatech SCE 110 ( Plasma etcher )

    Anatech USA’s SCE-100 Series Inductively Coupled (ICP) Plasma systems are extremely effective for a Plasma Ashing process to remove organics prior to thin film deposition and/or chemical analysis of remaining inorganics.

    Process gases are CF4, O2, Ar and N2. Sample sizes are pieces to 150mm round wafers.

    Anatech SCE 110

  • Automatic Bottle Washer ( Wet chemical bench )

    Automatic bottle washer
    Capable of rinsing three bottles simultaneously

    Automatic Bottle Washer

  • Base Process Bench ( Wet chemical bench )

    Substrates up to 150mm
    Goose neck sink
    N2 and DI water guns

    Base Process Bench

  • Bruker Dimension 3000 AFM ( Atomic force microscope )

    Thin film characterization is carried out in the NCF’s Ion Scattering Laboratory, located in the Laboratory for Research on the Structure of Matter. At the heart of this laboratory is an NEC 5SDH 1.7MV Pelletron Accelerator, which is capable of producing ion beams ranging from 0.2-5.1 MeV. The laboratory maintains a beam line and end station for Rutherford Backscattering, Particle Induced X-ray Emission and Forward Recoil Spectrometry and ion implantation. A computer-controlled goniometer aids in the collection of channel maps for crystal structure orientation studies and ion implantation applications.

    Bruker Dimension 3000 AFM

  • Bruker Multimode AFM ( Atomic force microscope )

    Thin film characterization is carried out in the NCF’s Ion Scattering Laboratory, located in the Laboratory for Research on the Structure of Matter. At the heart of this laboratory is an NEC 5SDH 1.7MV Pelletron Accelerator, which is capable of producing ion beams ranging from 0.2-5.1 MeV. The laboratory maintains a beam line and end station for Rutherford Backscattering, Particle Induced X-ray Emission and Forward Recoil Spectrometry and ion implantation. A computer-controlled goniometer aids in the collection of channel maps for crystal structure orientation studies and ion implantation applications.

  • Cambridge NanoTech S200 ( Atomic layer deposition system )

    Savannah is equipped with high-speed pneumatic pulse valves to enable our unique Exposure Mode™ for thin film deposition on Ultra High Aspect Ratio substrates. This proven precision thin film coating methodology can be used to deposit conformal, uniform films on substrates with aspect ratios of greater than > 2000:1.

    The Penn Savannah is capable of holding substrates of different sizes (up to 200mm). It is equipped with six precursor lines for deposition of Al2O3, HfO2, TiO2, and SiO2.

    Cambridge NanoTech S200

  • Cascade Micromanipulator 6000 ( Micromanipulator )

    Cascade Alessi Probe Station
    100mm wafers
    Four probe arms
    X-Y-Z-theta stage
    Independent microscope movement
    Typical uses are for ohmic/Schottky contact characterization

    Cascade Micromanipulator 6000

  • Dehydration Oven ( Oven )

    Digital gravity convection oven for curing samples from 25-250C

    Dehydration Oven

  • Denton Explorer 14 ( Thermal evaporator )

    Open load system in sputter-down configuration
    Two DC guns
    Able to co-sputter one DC and one RF source
    One RF gun
    Cryo pumped with automated interface
    Automated control of film thickness
    Pieces through 150mm wafers
    Wafer platen rotation with cooling
    Substrate cleaning

    Denton Explorer 14

  • Dimatix DMP-2831 ( Printer )

    The DMP-2831 allows the deposition of fluidic materials on an 8×11 inch or A4 substrate, utilizing a disposable piezo inkjet cartridge. This printer can create and define patterns over an area of about 200 x 300 mm and handle substrates up to 25 mm thick with an adjustable Z height. The temperature of the vacuum platen, which secures the substrate in place, can be adjusted up to 60°C. The DMP-2831 offers a variety of patterns using a pattern editor program. Additionally, a waveform editor and a drop-watch camera system allows manipulation of the electronic pulses to the piezo jetting device for optimization of the drop characteristics as it is ejected from the nozzle. This system enables easy printing of structures and samples for process verification and prototype creation.

    Fiducial camera features:
    Provides substrate rotation alignment using reference marks
    Allows positioning of the print origin to match substrate placement
    Provides measurement of features and locations
    Provides inspection and image capture of printed pattern or drops
    Provides cartridge alignment when using multiple cartridges
    Allows matching drop placement to previously patterned substrate


    FUJIFILM Dimatix has created a MEMS-based cartridge-style print head that allows users to fill their own fluids and print immediately with the DMP in their own laboratory. To minimize waste of expensive fluids, each cartridge reservoir has a capacity of 1.5 ml. Cartridges can easily be replaced to facilitate printing of a series of fluids. Each single-use cartridge has 16 nozzles linearly spaced at 254 microns with typical drop sizes of 1 and 10 picoliters.

    Dimatix DMP-2831

  • E-Beam Resist Hot Plate Tower ( Hot plate )

    Each hot plate tower in QNF is outfitted with (6) Torrey Pines digital thermal hot plates that can be heated to 350C with controlled ramping. In addition, there is a stainless steel gravity convection capable of heating to 300C in each tower as well.

    E-Beam Resist Hot Plate Tower

  • E-Beam Thermal Evaporator – Lesker PVD 75 1 ( Thermal evaporator )

    Two thermal sources
    Four pocket e-beam at 10kV
    Cryo pumped with automated interface
    Automated control of film thickness
    Pieces through 150mm wafers
    Wafer platen rotation with cooling stage

    E-Beam Thermal Evaporator – Lesker PVD 75 1

  • Electron Beam Lithography Spinner ( Spin coater )

    Maximum speed of 10,000 rpm
    User friendly programmable interface
    Programmable step functions (up to 10 steps per recipe)
    Programmable process control
    Wafer sizes from pieces through 150mm

    Electron Beam Lithography Spinner

  • Electron Beam Resist Oven ( Oven )

    Digital gravity convection oven for curing samples from 25-250C

    Electron Beam Resist Oven

  • Electroplating Process Bench ( Wet chemical bench )

    Substrates up to 150mm
    Two stations for plating Cu, Ni or Au
    Goose neck sink
    N2 and DI water guns

    Electroplating Process Bench

  • Elionix ELS-7500EX ( Electron beam lithography system )

    Ultra-high precision lithography with a resolution of 10 nm and with high stitching and overlay accuracy.

    Specifications
    Electron gun emitter ZrO/W thermal field emitter
    Acceleration voltage 50kV,30kV,20kV
    Minimum line width 10nm
    Specimen size 6″ (maximum)


    Features
    Ultra-fine lithography.

    The 2-nm diameter spot beam allows the ultra fine pattern writing of 10 nm width. ELS-7500EX incorporates SEM function that serves for exposed pattern observation.
    High stitching and overlay accuracy.

    ELS-7500EX provides overlay accuracy of 30 nm that supports mix-and-match with photolithography.
    The recipe function, with saved optimum beam settings, provides the ease of the operation.
    The stage with a built-in laser interferometer and beam positioning resolution of 0.31 nm with an 18-bit DAC provide a stitching accuracy of 30 nm.
    High performance with compact configuration. Ease of operation with PC control.

    Integration of a Windows compatible GUI and CAD realizes a small footprint.
    Electron optical condition control and CAD pattern design can be accomplished by simply using a mouse. A very user friendly system.

    Elionix ELS-7500EX

  • EVG 510 Wafer Bonder ( Flip chip bonder )

    The EVG501 Wafer Bonding System is a highly flexible R&D system that can handle small substrate pieces up to 200 mm wafers. The new tool supports a variety of bonding processes, such as anodic, glass frit, eutectic, diffusion, fusion, solder,and adhesive bonds, as well as other thermal processes, including oxide removal and high temperature bakes under a controlled atmosphere. The system also offers quick re-tooling with a conversion time of less than five minutes, making it ideal for universities and R&D as well as small-volume production applications.

    Features
    R&D and pilot line production
    Bonds up to 10 kN force at temperatures up to 450°C
    Real and low-force wafer wedge compensation system for highest yield
    Large process window: temperature uniformity <+/- 1% and pressure uniformity
    <+/- 5%

    EVG 510 Wafer Bonder

  • EVG 620 Wafer Bond Aligner ( Mask aligner )

    Known for its high level of automation and reliability, the EVG620 Bond Alignment System is designed for wafer-to-wafer alignment up to 150 mm wafer sizes. The EV Group´s bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG´s bond alignment system accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.

    Features
    Supports bond alignment of double or triple wafer stacks up to 150 mm wafer sizes
    Manual or motorized alignment stage
    Fully motorized high resolution bottom side microscopes
    Windows® based user interface
    Quick tool change between different wafer sizes and different bonding applications

    EVG 620 Wafer Bond Aligner

  • FEI Strata DB235 FIB ( Ion source )

    The FEI Strata DB235 FIB marries a high-resolution field emission SEM with a focused ion beam for precision milling, reactive ion-etching, and ion-assisted deposition with 4 gas injection systems. The FIB platform is upgraded with a nanomanipulator and an in-situ tensile stage, allowing variable temperature observation of nanomechanical properties and providing fundamental insights into work hardening, defect propagation and deformation. An integrated cryogenic stage allows for the ion milling of specimens at temperatures as low as -180°C, enabling the study of materials, such as some polymers, that cannot be milled at room temperature. The FEI FIB bridges the gap between nanocharacterization and nanofabrication by combining a high-resolution field-emission scanning electron microscope with a focused ion beam. Uniting these techniques in a single instrument allows users to seamlessly switch from secondary electron imaging to precision ion milling, ion-beam assisted material deposition and selective etching. The four gas injection systems will allow for platinum and tungsten deposition, enhanced etching and selective etching of carbon.

    FEI Strata DB235 FIB

  • Filmetrics F40 ( Reflectometer )

    The F40 has an integrated color video camera that allows exact monitoring of the film thickness measurement of a 20um square spot.

    Filmetrics F40

  • Filmetrics F50 ( Reflectometer )

    The Filmetrics F50 family of products can map film thickness as quickly as two points per second. A motorized R-Theta stage accepts standard and custom chucks for samples up to 200mm in diameter.

    Map patterns can be polar, rectangular, or linear, or you can create your own with no limit on the number of measurement points. Dozens of pre-defined map patterns are supplied.

    Filmetrics F50

  • HF Process Bench ( Wet chemical bench )

    Substrates up to 150mm
    5:1 BOE tank (room temperature)
    Cascade rinse tank
    Goose neck sink
    N2 and DI water guns

    HF Process Bench

  • IPG Photonics IX-255 ( Laser cutter )

    A highly flexible UV laser micromachining system for multi-purpose, R&D and production applications. The system combines a Class 1 workstation integrated with a proprietary UV laser, tool shape selector and software for complex automation sequences.

    Applications
    Micro Drilling
    Annealing
    Thin-film Removal
    Laser Lift-off (LLO)
    Dicing
    Features
    Pre-set Configurations for High Fluence and Large Field of View Applications
    Selectable Beam Shapes for Automated, Complex Micromachining
    Precision Stages with <3 μm Motion Control Accuracy
    Dual Magnification Vision System with Sub-micron Part Alignment
    193 nm Laser
    Linear Mask Changer for Complex Features and Shapes

    IPG Photonics IX-255

  • IPG Photonics IX200F ( Laser cutter )

    A highly configurable laser work cell for general purpose and small-scale production applications. The system combines a Class 1 workstation integrated with a fiber laser and all necessary software. Configurable options, available with initial order or as a field upgrade, include: Ablation or Thermal Cutting & Drilling, Part Handling & Moving, Beam Formation, Delivery & Scanning, Vision System and Alignment. Additional options and accessories further extend the versatility and application of this easy- to-use laser micromachining system. The IX-200-F can be configured with basic functionality as an entry-level system, as a fully equipped, highly precise machining tool compatible with any micromachining application, or anywhere in between. The modular design allows users to buy the capability needed today and expand through field upgrades as requirements evolve.

    Cutting Applications
    Ceramics, Metals, Polymers and Semiconductor Materials
    Patterning of ITO and other Thin-films
    Drilling Applications
    Hole Diameters down to 15 μm
    Class 1 Micromachining Workstation
    Lasers at 532 or 1064 nm
    Pulse Energy up to 15 Joules (1064 nm)
    X-Y Positional Accuracy: <3 μm
    Z-theta Accuracy: <10 μm, ±0.02°
    Galvanometer Scanner or Fixed Optics
    Thermal Cutting Head
    Step and Scan Stage/ Galvo Integration
    Vision System Resolution 0.12 μm/ pixel

    DXF and CSV File Interface

    IPG Photonics IX200F

  • J.A. Woollam V VASE Spectroscopic Ellipsometer ( Ellipsometer )

    The VASE is one of the most accurate and versatile ellipsometer for research on all types of materials: semiconductors, dielectrics, polymers, metals, multi-layers, and more.

    It combines high accuracy and precision with a wide spectral range up to 300 to 1100nm. Variable wavelength and angle of incidence allow flexible measurement capabilities including:

    Reflection and Transmission Ellipsometry
    Generalized Ellipsometry
    Reflectance (R) intensity
    Transmittance (T) intensity
    Cross-polarized R/T
    Depolarization
    Scatterometry
    Mueller-matrix

    J.A. Woollam V VASE Spectroscopic Ellipsometer

  • JEOL 2010F TEM/STEM ( Transmission electron microscope )

    The JEOL 2010F TEM/STEM is a state-of-the-art field emission transmission electron microscope with capabilities ranging from nanobeam and convergent beam diffraction to high-resolution phase contrast, analytical, and energy filtered imaging. The 2010F has been optimized for analytical microscopy with a large solid angle for high X-ray throughput, scanning, scanning-transmission, and backscattered electron detectors and a Gatan image filter for energy filtered imaging and electron energy loss spectroscopy. This combination of analytical capabilities makes the 2010F an ideal instrument for the characterization of a wide array of samples, yet the 2010F is also a very capable high-resolution instrument for the study of nano-scale materials. The instrument is compatible with a suite of commercial and custom in-situ sample stages. The PRNF maintains a wide range of commercial and custom heating, cooling and in-situ electrical testing holders. Planned purchases of a dual axis electron tomography holder and a cryo-tomography holder will significantly advance capabilities to develop 3D reconstructions of nanomaterials and the distribution of nanomaterials in complex assemblies and in biological hosts. The recent acquisition of a Hysitron PI 95 Picoindentor greatly advances in-situ nanomechanical measurements allowing direct correlation between the application of force and the structural response of materials.

    JEOL 2010F TEM/STEM

  • JEOL 2100 HRTEM ( Transmission electron microscope )

    The JEOL 2100 Transmission Electron Microscope (TEM) is available for both conventional and high resolution TEM imaging. It is equipped with single tilt, double-tilt, heating and cooling sample holders for a wide range of imaging experiments. The analytical objective lens pole piece on this microscope allows for sample tilting up to 33 degrees, yet maintains a point-to-point resolution of 0.25 nm. In addition to the conventional plate camera, this microscope is equipped with a Gatan Peltier cooled CCD imaging system for high quality digital imaging and video streaming.

    JEOL 2100 HRTEM

  • JEOL 7500F HRSEM ( Scanning electron microscope )

    The JEOL 7500F Scanning Electron Microscope provides ultrahigh resolution of 0.8 nm at 30 kV and 1 nm at 1 kV, which is particularly useful for soft-matter studies. The JEOL 7500F SEM is our dedicated conventional and high-resolution imaging microscope. It is equipped with multiple detectors and imaging modes that allow for the study of a wide range of solid materials. Secondary and backscattered electron detectors allow for imaging of sample surfaces, whereas a scanning-transmission electron detector shows the internal structure of materials. Through a stage biasing system, referred to as the “gentle-beam” mode, the electron beam interacting with the sample may be reduced to a fraction of the accelerating voltage of the gun, allowing for the imaging of soft or insulating samples without the need for carbon or metal coating.

    JEOL 7500F HRSEM

  • Keithley 3600 ( Electronic test equipment )

    Keithley’s Series 2400 Source Measure Unit (SMU) Instruments are designed specifically for test applications that demand tightly coupled sourcing and measurement. The SourceMeter provides precision voltage and current sourcing as well as measurement capabilities. Each SourceMeter SMU instrument is both a highly stable DC power source and a true instrument-grade 6½-digit multimeter. The power source characteristics include low noise, precision, and readback. The multimeter capabilities include high repeatability and low noise. The result is a compact, single-channel, DC parametric tester. In operation, these instruments can act as a voltage source, a current source, a voltage meter, a current meter, and an ohmmeter.

    Keithley 3600

  • KLA 2D Profilometer ( Profilometer )

    The P-7 stylus profiler offers industry leading measurement repeatability for reliable measurement performance. The surface measurement system has 150 mm scan length standard – the only stylus profiler on the market to offer long scan capability without the need for stitching. The UltraLite® sensor includes dynamic force control, excellent linearity, and the highest vertical resolution making it the best sensor available on a surface measurement system. Finally, this stylus profiler’s surface measurement system includes point-and-click operation and the productivity package to offer the easiest to use tool on the market with the features required by university, R&D, and production environments.

    The P-7 Stylus profiler is capable of addressing a wide range of surface measurements and applications:

    Thin film step height measurements
    Thick film step height measurements
    Photo resist / soft films
    Etched trench depth

    KLA 2D Profilometer

  • KLA 3D Profilometer ( Profilometer )

    The P-7 stylus profiler offers industry leading measurement repeatability for reliable measurement performance. The surface measurement system has 150 mm scan length standard – the only stylus profiler on the market to offer long scan capability without the need for stitching. The UltraLite® sensor includes dynamic force control, excellent linearity, and the highest vertical resolution making it the best sensor available on a surface measurement system. Finally, this stylus profiler’s surface measurement system includes point-and-click operation and the productivity package to offer the easiest to use tool on the market with the features required by university, R&D, and production environments.

    The P-7 Stylus profiler is capable of addressing a wide range of surface measurements and applications:

    Thin film step height measurements
    Thick film step height measurements
    Photo resist / soft films
    Etched trench depth
    Materials characterization for surface roughness and waviness
    Surface curvature and form
    2D stress of thin films
    Dimensional analysis and surface texture
    3D imaging of various surfaces
    Flatness or curvature
    Defect review and defect analysis

    KLA 3D Profilometer

  • Kulicke 4523 Wire Bonder ( Wire bonder )

    Aluminum wire wedge bonder. It provides digital controls with semiautomatic bonding cycle, but manual alignment.

    The bonder can be operated in auto cycle or manual mode. The auto cycle mode is the preferred mode for most applications. Stitch bonding can be performed in the auto cycle mode. The manual mode is useful when the elevation between subsequent bond-pairs is substantially different.

    Kulicke 4523 Wire Bonder

  • Lesker Nano 36 ( Thermal evaporator )

    Four thermal sources
    Quick turbo pumping automated interface
    Automated control of film thickness
    Pieces through 150mm wafers
    Wafer platen rotation

    Lesker Nano 36

  • Lesker PVD 75 2 ( Electron beam physical vapor deposition system )

    Load locked system
    Four pocket e-beam at 10kV
    Cryo pumped with automated interface
    Automated control of film thickness
    Pieces through 150mm wafers
    Wafer platen rotation

    Lesker PVD 75 2

  • Lesker PVD 75 3 ( Thermal evaporator )

    Load locked system
    Three DC guns
    Able to co-sputter two DC sources
    One RF gun
    Cryo pumped with automated interface
    Automated control of film thickness
    Pieces through 150mm wafers
    Wafer platen rotation with heating

    Lesker PVD 75 3

  • Lucas Labs 4PP ( Electronic test equipment )

    Wafer sizes from pieces to 150mm
    Manual system that combines with a current source and electronic DVM combined
    Accuracy of better than 1% over the resistivity range from 1 milli-ohm to 2 Meg-ohms per square.
    Simple to perform sheet and bulk resistivity measurements

    Lucas Labs 4PP

  • Nanonex 2600 Nanoimprinter and Mask Aligner ( Mask aligner )

    The Nanonex NX-2600 is a full wafer nanoimprinter and photolithography aligner. It is capable of all imprint forms: thermal, photo-curable, embossing and photolithography, with sub-5nm imprinting resolution and sub-1 micrometer alignment accuracy. Based on the Nanonex unique patented Air Cushion PressTM technology, the NX-2600 offers unsurpassed uniformity regardless of backside topology, wafer or mask flatness, or backside contamination. This ACP technology also eliminates lateral shifting between the mask and substrate, which significantly increases mask lifetime.

    Standard nanoimprint resists are provided. Front and backside mask alignment.

    Nanonex 2600 Nanoimprinter and Mask Aligner

  • NEC Mini-Tandem 5.1 MeV Ion Accelerator ( Ion source )

    Thin film characterization is carried out in the NCF’s Ion Scattering Laboratory, located in the Laboratory for Research on the Structure of Matter. At the heart of this laboratory is an NEC 5SDH 1.7MV Pelletron Accelerator, which is capable of producing ion beams ranging from 0.2-5.1 MeV. The laboratory maintains a beam line and end station for Rutherford Backscattering, Particle Induced X-ray Emission and Forward Recoil Spectrometry and ion implantation. A computer-controlled goniometer aids in the collection of channel maps for crystal structure orientation studies and ion implantation applications.

    NEC Mini-Tandem 5.1 MeV Ion Accelerator

  • Negative Resist Hot Plate Tower ( Hot plate )

    Each hot plate tower in QNF is outfitted with (6) Torrey Pines digital thermal hot plates that can be heated to 350C with controlled ramping. In addition, there is a stainless steel gravity convection capable of heating to 300C in each tower as well.

    Negative Resist Hot Plate Tower

  • Negative Resist Oven ( Oven )

    Digital gravity convection oven for curing samples from 25-250C

    Negative Resist Oven

  • Negative Resist Spinner ( Spin coater )

    Two Spinners
    Maximum speed of 10,000 rpm
    User friendly programmable interface
    Programmable step functions (up to 10 steps per recipe)
    Programmable process control
    Wafer sizes from pieces through
    -300mm capable bowl sizes

    Negative Resist Spinner

  • NewView™ 7300 3D Optical Surface Profiler ( Profilometer )

    The NewView™ 7300 white light interferometer (profilometer) is a powerful tool for characterizing and quantifying surface roughness, step heights, critical dimensions, and other topographical features with excellent precision and accuracy. All measurements are nondestructive, fast, and require no sample preparation. Profile heights ranging from < 1 nm up to 10000 µm at high speeds, independent of surface texture, magnification, or feature height!

    Using ZYGO’s Coherence Scanning Interferometry (CSI) technology, the NewView™ 7300 3D optical surface profiler easily measures a wide range of surfaces, including smooth, rough, flat, sloped, and stepped surfaces.

    Key Features:
    • Fast non-contact measurements
    • Sub-angstrom Z resolution
    • Leading-edge precision & gage capability
    • Enhanced optical imaging

    NewView™ 7300 3D Optical Surface Profiler

  • Olympus Scope 1 ( Optical microscope )

    5x, 10x, 20x, 50x and 100x objectives
    Bright field and dark field
    Nomarski imaging
    Digital frame grabbing and measurement software

    Olympus Scope 1

  • Olympus Scope 3 ( Optical microscope )

    5x, 10x, 20x, 50x and 100x objectives
    Bright field and dark field
    Nomarski imaging
    Digital frame grabbing and measurement software

    Olympus Scope 3

  • Optical Inspection Scope #2 ( Optical microscope )

    5x, 10x, 20x, 50x and 100x objectives
    Bright field and dark field
    Nomarski imaging
    Digital frame grabbing and measurement software

    Optical Inspection Scope #2

  • Oxford Plasma Lab 100 ( Chemical vapor deposition system )

    This is a load locked PECVD system capable of depositing SiO2, Si3N4 and a-Si. Process temperatures range from room temperature through 400C. In addition to standard RF plasma, there is a low frequency source for stress tuning films. The system handles 4”/100mm wafers.

    Oxford Plasma Lab 100

  • Oxford PlasmaLab 80+ ( Reactive ion etcher )

    A compact open-loading tool for Reactive Ion Etching – Oxford 80+ RIE

    The Oxford 80+ offers versatile reactive ion etch solutions on one platform with convenient open loading. This compact, small footprint system is easy to use, with no compromise on process quality.

    It is ideally suited to R&D or small-scale production, and can process from the smallest wafer pieces to 200mm wafers. The open load design allows fast wafer loading and unloading, ideal for research, prototyping and low-volume production.

    600W RF generator
    Up to 200mm wafers
    Process gases: CF4, Ar, O2, SF6 and CHF3
    Excellent etch control
    Excellent process control
    Documented baseline recipes are provided by Penn’s QNF staff

    Oxford PlasmaLab 80+

  • Paralyne Deposition System ( Chemical vapor deposition system )

    The SCS Labcoter® 2 (PDS 2010) vacuum deposition system is specifically designed to bring Parylene technology to the laboratory. Its size and portability make it the ideal choice for universities and research institutions lookingto to develop and design with Parylene conformal coatings.

    As a high quality, compact coating unit, the PDS 2010 is well suited for a range of applications, including circuit boards, sensors, wafers, medical devices and elastomeric components for research, development and repair.

    Paralyne Deposition System

  • PDMS Process Bench ( Wet chemical bench )

    Substrates up to 150mm
    Solvent develop and PDMS mixing station

    PDMS Process Bench

  • Positive Resist Hot Plate Tower ( Hot plate )

    Each hot plate tower in QNF is outfitted with (6) Torrey Pines digital thermal hot plates that can be heated to 350C with controlled ramping. In addition, there is a stainless steel gravity convection capable of heating to 300C in each tower as well.

    Positive Resist Hot Plate Tower

  • Positive Resist Oven ( Oven )

    Digital gravity convection oven for curing samples from 25-250C

    Positive Resist Oven

  • Positive Resist Spinner ( Spin coater )

    Three Spinners
    Maximum speed of 10,000 rpm
    User friendly programmable interface
    Programmable step functions (up to 10 steps per recipe)
    Programmable process control
    Wafer sizes from pieces through 150mm

    Positive Resist Spinner

  • Princeton Instruments Tri-Vista spectrometer with SI and InGaAs array detectors ( Spectrophotometer )

    The TriVista system is a triple spectrometer that has multiple input and detection ports that we can configure to provide Raman scattering down to 5 cm-1, photoluminescence excitation/emission spectral mapping, absorption, as well as spatial imaging of Raman scattering or photoluminescence with an infinitely tunable (in width and center wavelength) bandpass filter from 350 nm to 1000 nm. For Raman scattering, the system can operate in either additive mode for high resolution experiments or in subtractive mode for extreme stray light rejection. The system has both Si and InGaAs detectors, providing detection bandwidth from 350 nm to 1.7 microns. Light sources include a Xenon lamp (from which any spectral range can be selected without altering the illumination profile) and a laser at 532 nm. We are able to measure samples on solid substrates and liquids within cuvettes.
    Instrumentation

    Princeton Instruments Tri-Vista 555 spectrometer (9 gratings)
    Princeton Instruments PIXIS-256E Si 2D array detector
    Princeton Instruments OMA-V InGaAs linear array detector
    Custom Optical Systems for Absorbance, Photoluminescence and Raman Scattering.

  • Quanta 600 FEG ESEM ( Scanning electron microscope )

    An FEI Quanta 600 FEG Mark II Environmental Scanning Electron Microscope achieves 1.5 nm resolution in ESEM mode and can be operated under a range of gaseous environments from 6 x 10-4 Pa to ~1000 Pa. It is equipped with a special wet STEM detector that is ideal for the imaging of nanoparticles in biological systems. This system is our platform for in-situ electron microscopy development with heating and cooling stages allowing imaging from 20-1000°C, dual Kleindiek nano-manipulators with a micro-droplet injection system for electrical and mechanical measurements, and gas injection systems for platinum and gold e-beam deposition. The Quanta SEM is equipped with a unique array of accessories to enable the combination of high-resolution imaging and nanoscale manipulation allowing for powerful in-situ experiments involving controlled stimuli and correlated response. In-situ capabilities include: nanoscale manipulation of specimen or probe, access to the large sample volume by fluids, gases, electrical, optical and mechanical probes; detection of sample response to such probes, including the electron beam itself; and the temperature dependences of all these phenomena.

    Quanta 600 FEG ESEM

  • Quantum Design PPMS 9 T ( Hall effect measurement system )

    This is second of two PPMS systems in the facility. It provides magnetic field up to 9 T and temperatures from 1.7 K to 400 K. Users are able to perform 2- and 4-wire magnetoresistance, thermal conductivity, heat capacity, Seebeck coefficient, and Hall effect measurements. The system is equipped with a turbo pump for the sample chamber.

  • Quantum Design PPMS 9 Tesla with EverCool-II™ ( Hall effect measurement system )

    "This is the first of two PPMS systems in the facility. It provides magnetic field up to 9 T and temperatures from 1.7 K to 400 K. Users are able to perform DC magnetic moment, AC magnetic susceptibility, 2- and 4-wire magnetoresistance, photoconductivity, and Hall effect.
    This system benefits from the PPMS EverCool-II™ dewar, which is the second generation of low-loss dewars with integrated Helium liquefier for the PPMS system from Quantum Design. It allows the continuous operation of the PPMS System without the supply with liquid Helium. The system is cryogen free for the user, and can hold temperatures below 2 K indefinitely."

  • Quantum Design’s MPMS 7 Tesla with EverCool-II™ ( Instrument )

    Quantum Design’s MPMS-XL provides sensitive SQUID (Superconducting QUantum Interference Device) magnetometry capabilities using Quantum Design’s Reciprocating Sample Option (RSO). In practice, we observe a noise floor of <10-8 emu for DC moment measurements. The system provides magnetic fields up to 7 Tesla and temperatures nominally between 2 K and 400 K. The MPMS has a fiber insert that permits studies of optically pumped magnetization, and an oven option that allows measurements up to 800 K when special needs arise.
    MPMS XL Features

    Cryogen Free with EverCool®
    SQUID Sensitivity
    Multiple Measurement Modes
    (Including Traditional MPMS DC Scan)
    Temperature Range: 1.8 – 400K
    7 Tesla Magnet

  • Reynolds Tech E-Beam Resist Spin & Develop Bench ( Wet chemical bench )

    This is a laminar flow bench containing one spinner with rotation speeds from 1-10,000 RPM. Wafer sizes from pieces to 150mm. Solvent drains and nitrogen guns at each spinner station. This bench is also used for e-beam resist development. Standard PMMA and ZEP 520A are provided.

    Reynolds Tech E-Beam Resist Spin & Develop Bench

  • Reynolds Tech Negative Photoresist Develop Bench ( Wet chemical bench )

    This is a negative photoresist developing bench with integrated single wafer rinsing for samples up to 150mm. Typical developers PGMEA based for SU-8. Another application is use of resist strippers that can be disposed in the integrated solvent drains.

    Reynolds Tech Negative Photoresist Develop Bench

  • Reynolds Tech Negative Photoresist Spinner Bench ( Wet chemical bench )

    This is a laminar flow bench with two spinners with rotation speeds from 1-10,000 RPM. Wafer sizes from pieces to 150mm. Solvent drains and nitrogen guns at each spinner station. PDMS can be spun in one of the spin station; the other station is typically used for SU-8, LOR and related negative resists.

    Reynolds Tech Negative Photoresist Spinner Bench

  • Reynolds Tech Positive Photoresist Develop Bench ( Wet chemical bench )

    This is a positive photoresist developing bench with integrated single wafer rinsing for samples up to 150mm.  Typical developers are 0.26N TMAH based.

    Reynolds Tech Positive Photoresist Develop Bench

  • Reynolds Tech Positive Photoresist Spinner Bench ( Wet chemical bench )

    This is a laminar flow bench with three spinners with rotation speeds from 1-10,000 RPM. Wafer sizes from pieces to 150mm. Solvent drains and nitrogen guns at each spinner station.

    Reynolds Tech Positive Photoresist Spinner Bench

  • Rudolph Auto Ellipsometer VIS/NIR ( Ellipsometer )

    This unit is Multi-Wavelength Ellipsometer with direct readout of thickness and refractive index of single and multi-layer films. The NIR-3 optics allows user to select 405nm, 633nm and 830nm. The longer wavelength option is ideal for plasma deposited films so they are rendered transparent.

    Substrates up to 150mm

    Wavelengths: 532, 633 and 808nm

    Rudolph Auto Ellipsometer VIS/NIR

  • Soft Lithography Hot Plate Tower ( Hot plate )

    Each hot plate tower in QNF is outfitted with (6) Torrey Pines digital thermal hot plates that can be heated to 350C with controlled ramping. In addition, there is a stainless steel gravity convection capable of heating to 300C in each tower as well.

    Soft Lithography Hot Plate Tower

  • Solvent Process Bench ( Wet chemical bench )

    Substrates up to 150mm
    Heated ultrasonic tank
    Goose neck sink
    N2 and DI water guns

    Solvent Process Bench

  • SPTS Deep Silicon Etch ( Reactive ion etcher )

    With an installed base of over 1000 DRIE process modules, SPTS’ market-leading position is spearheaded by the Rapier module, which etches Si using Bosch switched processing as well as non-switched etching for tapered profiles, wafer thinning and via reveal.

    Advantages of SPTS Si DRIE
    Patented dual plasma source design with independently controlled primary and secondary decoupled plasma zones, with independent dual gas inlets. This results in a highly concentrated and uniformed distribution of radicals.
    High etch rate
    Excellent uniformity
    Controls tilting of deep features across the wafer
    Inherent multi-mode flexibility also allows complementary oxide etching within the same hardware.
    Delivering unparalleled process capability with world-class productivity & cost of ownership benefits, SPTS’ DRIE process modules are used in a wide variety of applications across multiple end markets.

    All processes at QNF are developed collaboratively with Nanofab staff, SPTS Applications and the PI group.

    SPTS Deep Silicon Etch

  • SPTS Xactix Xetch ( Reactive ion etcher )

    Isotropic etching of silicon using xenon difluoride is an ideal solution for releasing MEMS devices. XeF2 shows high selectivity to silicon over almost all standard semiconductor materials including photoresist, silicon dioxide, silicon nitride and aluminum. Being a vapor phase etchant, XeF2 avoids many of the problems typically associated with wet or plasma etch processes.

    Built for simplicity, and a small footprint, the Xactix® e1TM is the ideal solution for requiring an R&D xenon difluoride etching system. This table top etcher is ideal for small volumes in QNF.

    Key Benefits
    Simple & reliable
    Great for working with small samples and wafers

    SPTS Xactix Xetch

  • SU-8 and PDMS Baking ( Oven )

    Digital gravity convection oven for curing samples from 25-250C

    SU-8 and PDMS Baking

  • SU-8/PDMS Resist Spinner ( Spin coater )

    Maximum speed of 10,000 rpm
    User friendly programmable interface
    Programmable step functions (up to 10 steps per recipe)
    Programmable process control
    Wafer sizes from pieces through 150mm

    SU-8/PDMS Resist Spinner

  • SU-8/PDMS Spin Bench ( Wet chemical bench )

    Substrates up to 150mm
    Spinner for SU-8, PDMS and related soft materials

    SU-8/PDMS Spin Bench

  • Suss MicroTec AltaSpray Automated Spray Coated AS8 ( Instrument )

    Suss MicroTec AltaSpray Automated Spray Coated AS8
    Automated Spray Coater for High Topographies

    SUSS MicroTec’s proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging.

    Wafer sizes from pieces to 200mm. Common resists sprayed are SU-8, S1800 and various AZ formulations.

    Suss MicroTec AltaSpray Automated Spray Coated AS8

  • SUSS MicroTec MA-6 ( Mask aligner )

    SUSS MicroTec MA-6

    The Dedicated Solution for Industrial Research and Operator Assisted Alignment

    Designed for R&D, pilot line and production environments, the MA/BA6 Gen3 enables production-friendly research. It allows easy and cost effective process transfer from laboratory to production. Key components such as high resolution optics, precise alignment system and graphical user interface perfectly match with the SUSS production aligner platform.

    High resolution (HR) optics allows patterning of structures below 0.5μm
    Operator assisted and auto alignment permits down to 0.25μm alignment accuracy
    Advanced automatic functions for maximum process control
    Process compatibility with automatic equipment
    Optimized split field microscope with direct viewing and/or LCD flat screen options
    Allows utilization of tool sets from the previous MA/BA6 platform
    Pieces through 150mm wafers.

    SUSS MicroTec MA-6

  • Technics RIE ( Reactive ion etcher )

    The Technics Series 800 RIE (Oxygen Plasma Asher) uses an oxygen plasma to remove organic materials, such as photoresist, from substrate surfaces. Common uses include descumming of resist from exposed surfaces before etching or metallization, or the cleaning of substrates to remove stubborn resist deposits. An oxygen plasma is used to isotropically remove organic material, like photoresist. Placing a substrate or wafer in an oxygen plasma for short periods of time will remove any unwanted thin layers of photoresist and clean up pattern edges. In essence, the plasma ashing or burning of the photoresist removes it. This material residue is normally referred to as scum.

    Technics RIE

  • Trion Phantom ( Reactive ion etcher )

    The Phantom III RIE is designed to supply research and failure analysis laboratories with state-of-the-art plasma etch capability using single wafers, dies or parts using fluorine and oxygen based chemistries. The system has a compact, modular design built on a space-saving platform.

    The cathode and anode are each machined out of single blocks of aluminum. After critical inspection they are hard anodized for protection from process chemistries. The bottom electrode is available in 150mm size and can process single wafers, dies or parts (2″ – 150mm). Process gases are introduced into the chamber either by a showerhead manifold (BCl3, Cl2, Ar and SF6).

    Trion’s carefully engineered ICP is a proven option for applications requiring a downstream, high-density plasma source. It dramatically reduces radiation damage and contamination from RIE sputtering and greatly increases selectivity to other films. It allows for higher plasma densities as power is transferred into the bulk plasma via the magnetic field resultant from inductive coupling. This enables processing at lower pressure, which has a number of significant benefits. It allows for tight anisotropy in high aspect ratio structures and reduces microloading effect. Trion’s ICP source will result in improved etch rates, profile control, uniformity and selectivity with a dramatic reduction in RIE radiation damage. The Phantom III ICP comes with a 600 watt, 13.56 MHz power supply and a built-in automatic matching network.

    Trion Phantom

  • Vacuum Oven ( Vacuum oven )

    Vacuum oven capable of reaching ~10 Torr with digital gravity convection for curing samples from 25-250C

    Vacuum Oven

  • Verteq Superclean Spin Rinse Dryer ( Spin rinse dryer )

    The SuperClean 1600-3 is a single cassette, front-loading, programmable rinser/dryer used to rinse and dry round substrates that are 100mm or 150mm in diameter. The system rinses to a DI water resistivity of ~12 Mohm before the heated nitrogen drying cycle commences.

    Verteq Superclean Spin Rinse Dryer

  • YES Vapor Phase Deposition System ( Chemical vapor deposition system )

    While wet chemical surface modification can be done, vapor phase deposition has become the preferred method for coating surface as the process environment can be tightly controlled. Due to liquid surface tension, the wet process can have poor contact between the solution and the surface, especially when the surface is textured with small features. Another problem with wet processing, or solution phase deposition, is this process typically uses water.

    Standard recipes include HMDS priming and image reversal with ammonia chemistry. Other chemistry and related SAM coatings can be developed on request.

    YES Vapor Phase Deposition System

Services

  • Singh Center for Nanotechnology instrument access ( Access service )

    The Singh Center is home to unique, state-of-the-art equipment. This high-performance equipment for nanotechnology research is easily accessible to faculty, staff and researchers.


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Last updated: 2016-03-10T14:53:42.083-05:00

Copyright © 2016 by the President and Fellows of Harvard College
The eagle-i Consortium is supported by NIH Grant #5U24RR029825-02 / Copyright 2016